Особенности реакций, протекающих при химическом осаждении пленок золота на поверхность металла

Abstract

It have been shown that the reaction of gold displacement from the dicyanoaurate solution is accompanied by intensive overstechiometric dissolution of nickel from the substrate. The process of eiectroless gold film plating in the presence of hypophosphite includes the reactions of cementation, overstechiometric nickel dissolution and its reduction from the solution. The inclusion of nickel into the near surface layers of the gold films about 2-4 at. % up to 0,05 pm provides the catalytic reduction of gold by hypophosphite. Gold plating is accompanied by the formation of AuCN in a trace quantity, that is the reason of gold film passivation and the limitation in the film thickness up to 0,3 pm.